Effective cooling of processors and chipsets in electronic devices is critical for maintaining performance and system security. In this context, an innovative design titled "A Heat Sink with Wood-Structured Fins," developed by academics at Hitit University, has been registered by the Turkish Patent and Trademark Office under registration number 2021 011504.
Widely used heat exchangers in industry are often expensive and restrict users in terms of volume and weight. This new invention, developed by Hitit University faculty members Prof. Dr. Seyfi Şevik and Assoc. Dr. Özgür Özdilli, offers a cost-effective, lightweight, flexible, and highly efficient cooling solution.
The invention is notable for its unique geometry consisting of:
A domed plate that tapers towards the edges,
Y-type central fins,
V-type edge fins,
And numerous corrugated wood-structured fins.
This innovative design provides a more compact and economical heat exchanger solution that will improve performance, especially in systems requiring high processing power, such as gaming computers and workstations.
Detailed information about the invention can be accessed through the Turkish Patent and Trademark Office.
Inventors:
Prof. Dr. Seyfi Şevik
Assoc. Prof. Dr. Özgür Özdilli
Patent Number: 2021 011504
To review:
