Equipped
to support your R&D and innovation processes, our Prototyping
Laboratory offers access to the latest high-tech equipment listed
below. By providing the tools you need during the product development
phase, we help bring your projects to life.
You can schedule an appointment through the LABSYS
system to make use of our laboratory, and manufacture your designed
prototypes under the guidance of our expert technical team. Throughout
the process, our experienced staff will provide technical support to
help transform your ideas into reality.
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| Craft CR3290 DK Universal Lathe Machine |
Craft Fr50 Plus Universal Toolroom Milling Machine | Craft T200 Bandsaw Machine | ||||||||
| Key Features | Key Features | Key Features | ||||||||
| • Motor Power: 1.5 kW, 400 V • Swing Over Bed: 320 mm • Swing Over Cross Slide: 190 mm • Swing Over Bridge: 430 mm • Bed Width: 181 mm • Distance Between Centers: 920 mm |
• Table Dimensions: 500 × 250 mm (standard) • Maximum Travel Distances: • X-Axis: 400 mm • Y-Axis: 250 mm • Z-Axis: 400 mm • Spindle Taper: ISO 40 or BT 40 |
• Motor Power: 850 W, 380 V • Cutting Angle: Adjustable between 0° and 45° • Cutting Angle Adjustment: Performed via the vise • Saw Blade Dimensions: 20 × 0.9 × 2360 mm |
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| M32 Column-Type Drill Press | ||||||||||
| Key Features | ||||||||||
| • Maximum Drilling Capacity: 32 mm (for steel) • Spindle Taper: MT3 or MT4 (Morse Taper) • Spindle Travel (Stroke): 120 – 150 mm • Spindle Speed Range: 100 – 2000 rpm (variable) |
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| Anycubic Kobra Max 3D Printer |
Creality Cp-01 Lazer + Cnc+ 3D Printer |
UltiMaker S3 3D Printer | ||||||||
| Key Features | Key Features | Key Features | ||||||||
| • Maximum Print Speed: 180 mm/s • 25-Point Auto Bed Calibration • Compatible with various filament types such as PLA, ABS, PETG, and TPU • Maximum Nozzle Temperature: 260 °C • Maximum Bed Temperature: 90 °C • Uses 1.75 mm Diameter Filament |
• 3D Printing Module: • Build Volume: 200 × 200 × 200 mm • Layer Thickness: 0.1 – 0.4 mm • Filament Diameter: 1.75 mm • Laser Engraving Module: • Laser Power: 0.5 W • Engraving Area: 100 × 190 mm • Compatible Materials: Wood, paper, plastic, leather • CNC Milling Module: • Working Area: 200 × 200 mm • Spindle Speed: Up to 4,800 rpm • Compatible Materials: Wood, paper, PCB, plastic |
• Build Volume: 230 × 190 × 200 mm • Layer Resolution: Up to 20 microns • Nozzle Diameters: 0.25 mm, 0.4 mm, 0.6 mm, 0.8 mm • Maximum Nozzle Temperature: 280 °C • Filament Diameter: 2.85 mm |
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| Shining 3D Ein Scan Pro HD 3D Scanner |
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| Key Features | ||||||||||
| • Scanning Modes: Handheld HD Scanning, Fixed Scanning • Handheld HD Scanning: Up to 3,000,000 points per second (10 fps) • Fixed Scanning: Scans each frame in less than 0.5 seconds • Volumetric Accuracy: 0.3 mm/m with marker alignment in handheld mode |
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| TIEVM-HV-1PH-DCAC - Single-Phase Inverter Development Kit with Voltage Source and Grid-Connected Operation Modes |
Single-Phase 800 V DC-Link Inverter Module |
Three-Phase Inverter Module with Delta Output |
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| Key Features | Key Features | Key Features | ||||||||
| • Single-Phase Inverter Development Kit • Capability to Operate in Both Voltage Source and Grid-Connected Modes • HV Components Optimized for High-Voltage Applications • Supports Active and Reactive Power Control • Digital Control Algorithms and Real-Time Monitoring System |
• Input Voltage: 150 VDC – 800 VDC • Isolation: 3.5 mm clearance and creepage between controller and power circuit • Snubber Capacitors: 10 nF – 33 nF (MMKP or NoBom), configurable based on user requirements • DeSat Protection Current Threshold: 70 A • Gate Driver: 1ED3431MC12MXUMA1 |
• Input Voltage: 240 VRMS (Phase–Neutral) / 416 VRMS (Phase–Phase) / 590 VDC • Isolation: 3.5 mm clearance and creepage between controller and power circuit; dielectric strength of 3 kV, 3 mA for 60 seconds • Snubber Capacitors: 10 nF – 47 nF (MMKP or NoBom), configurable based on user requirements • DeSat Protection Current Threshold: 120 A |
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| 50V-20A Fixed Output Voltage SMPS |
150V-7A Fixed Output Voltage SMPS | Siglent SDS814X HD 100 MHz 4-Channel 12-Bit Oscilloscope | ||||||||
| Key Features |
Key Features | Key Features |
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| • Input: Single-phase, 195–253 VAC, 47–63 Hz, input power factor > 0.95 • Protection Threshold (AC): Undervoltage cutoff at 180 VAC, overvoltage cutoff at 265 VAC, inrush current < 40 A • Output Ratings: 50 VDC, 20 A, 1000 W (non-derated) • Overcurrent and Overvoltage Protection: Overcurrent protection at 125%, overvoltage limit at 55 V, rise time: 50 ms |
• Input and Phase: Single-phase, 195–253 VAC, 47–63 Hz • Input Power Factor: Approximately 0.9 • Inrush Current: < 50 A • Output Power (Non-Derated): Continuous output at specified nominal rating • Output Ratings: 150 VDC, 7 A • Overcurrent Protection: Supports both auto-recovery and latch (lockout) modes |
• Sampling and ADC: 12-bit resolution, up to 2 GSa/s sampling rate, front-ends with 200 MHz bandwidth and 70 μVrms noise floor • Channels and Performance: 4 analog channels, 100 MHz bandwidth, SPO (Super Phosphor Oscilloscope) technology, waveform capture rate of 120,000 wfm/s (normal) and 500,000 wfm/s (sequence mode) • Display and Visualization: 256-level intensity grading, color temperature mode, 7″ TFT-LCD capacitive touchscreen (1024×600 resolution) |
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| TI LAUNCHXL-F280049C Development Kit | LAUNCHXL-F280039C Development Kit |
TI BOOSTXL-BUCKCONV Digital DC Buck Converter | ||||||||
| Key Features | Key Features | Key Features |
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| • Microcontroller:
TMS320F280049C (100 MHz C28x CPU with FPU and TMU support, 256 KB
Flash, InstaSPIN-FOC enabled, 3× 12-bit ADCs, CAN, encoder, FSI, UART,
and more) • Integrated Debug Unit: XDS110 debug probe for real-time debugging and flash programming • LaunchPad Ecosystem: Extended LaunchPad design with 80-pin connectivity, compatible with BoosterPack plug-in modules |
• Mikrodenetleyici: TMS320F280039C, 120 MHz C28x CPU (FPU, TMU) ve 120 MHz CLA, CLB, 384 KB Flash • Analog ve Dijital Özellikler: 3x 12-bit ADC, 16 PWM kanalı • CAN Desteği: Hem standart CAN (DCAN) hem de CAN-FD (MCAN) desteği; yerleşik CAN transceiver ve konektör • Enkoder ve FSI: 2x eQEP (enkoder arayüzü) modülü ve FSI konektörü |
• Microcontroller: TMS320F280039C, 120 MHz C28x CPU (with FPU, TMU) and 120 MHz CLA, CLB, 384 KB Flash • Analog and Digital Features: 3× 12-bit ADCs, 16 PWM channels • CAN Support: Supports both standard CAN (DCAN) and CAN-FD (MCAN); includes onboard CAN transceiver and connector • Encoder and FSI: 2× eQEP (quadrature encoder interface) modules and FSI connector |
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